YAG SYSTEM APPLICATIONS
  

 
   Laser Micro-machining

• Reticulation (@ 0.53 μm) in LiTaO3, KTN (line width 7 μm, aspect ratio 100:1)

• Hole piercing in sapphire, silicon, aluminum nitride, ceramics (diameter 17 μm, aspect ratio 20:1)

• Hole machining (@ 1.06 μm) in sapphire, metals, aluminum nitride, ceramics (diameter 50 μm, straight walls)

• Scribing on various dielectrics and metals

• Dicing of sapphire and ceramic wafers;
    a.  odd shapes
    b.  high precision
    c.  less damage

• Gaskets: rubber, plastic, etc.